Abstract:
A method and related apparatus for scoring a workpiece are disclosed. A first scoring die has a score section structured to score a workpiece in a predetermined pattern, a second scoring die having as a score section structured to score a workpiece in a predetermined pattern substantially identical to the predetermined pattern of the first score scoring die. In operation the method and apparatus align the first scoring die and second scoring die and score the workpiece from opposite sides to effect complete or substantially complete reduction of the workpiece in a predetermined path to define a part. The workpiece will generally be a sheet. The scoring dies will each have score sections having one surface configured to be substantially perpendicular to the longitudinal axis of the workpiece and an adjacent angularly disposed surface structured to be adjacent to the scrap being produced by the scoring operation.