公开(公告)号：US20150038787A1

公开(公告)日：2015-02-05

申请号：US14503839

申请日：2014-10-01

Applicant: OLYMPUS CORPORATION

Inventor： Yoshiro NISHIMURA

IPC: A61B1/06 ,  A61B1/05

CPC classification number: A61B1/0684 ,  A61B1/00096 ,  A61B1/05 ,  A61B1/051 ,  A61B1/0638 ,  A61B1/0676 ,  G02B23/2423 ,  G02B23/2446 ,  G02B23/2484

Abstract: An endoscope includes illumination units and an image pickup unit that acquires an object image, in a distal end portion of an insertion portion. Each the illumination unit includes: a light-emitting section including an LED, the light-emitting section outputting light from an upper surface; a wiring board including a recess portion with the light-emitting section disposed therein, and a connection electrode connected to a device electrode of the LED via a relay electrode and an internal wiring in a first principal surface; a prism disposed above the upper surface of the light-emitting section with a transparent resin layer interposed therebetween, the prism changing a direction of the light outputted by the light-emitting section; and a signal cable connected to the connection electrode.

Abstract translation: 内窥镜包括照明单元和在插入部的前端部中获取被摄体图像的摄像单元。 每个照明单元包括：发光部分，其包括LED，所述发光部分输出来自上表面的光; 包括其中设置有发光部的凹部的布线板以及通过中继电极和第一主面内的内部布线而与LED的器件电极连接的连接电极; 棱镜，其设置在所述发光部的上表面的上方，透明树脂层插入其间，所述棱镜改变由所述发光部输出的光的方向; 和连接到连接电极的信号电缆。

公开(公告)号：US20190274529A1

公开(公告)日：2019-09-12

申请号：US16416522

申请日：2019-05-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA ,  Takatoshi IGARASHI ,  Kensuke SUGA ,  Yoshiro NISHIMURA

IPC: A61B1/05 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00 ,  H04N5/225

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

公开(公告)号：US20210096355A1

公开(公告)日：2021-04-01

申请号：US17078794

申请日：2020-10-23

Applicant: OLYMPUS CORPORATION

Inventor： Yoshiro NISHIMURA ,  Hiroshi IWAISAKO

IPC: G02B23/24 ,  H04N5/225 ,  H04N7/18 ,  G02B23/26

Abstract: An image pickup apparatus for endoscope includes: an imager, an optical device, an optical module on which the optical device is mounted, an optical fiber optically coupled with the optical device, a ferrule having an insertion hole into which the optical fiber is inserted, and a wiring board including a first rigid board, a second rigid board and a flexible intermediate board. The ferrule is fixed to the second rigid board or a first principal surface of the optical module. A first side surface of the optical module is glued to the first rigid board, and the first principal surface is glued to the second rigid board.