公开(公告)号：US20200058630A1

公开(公告)日：2020-02-20

申请号：US16486559

申请日：2018-03-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm ,  Andreas PIössl

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L33/40 ,  H01L33/62 ,  H01L33/56 ,  H01L33/00

Abstract: A method of manufacturing an optoelectronic component includes: A) providing a sub-strate, B) providing a metallic liquid arranged in a structured manner and in direct mechanical contact on the substrate and including at least one first metal, C) providing semiconductor chips each having a metallic termination layer on their rear side, the metallic termination layer including at least one second metal different from the first metal, and D) self-organized arranging the semiconductor chips on the metallic liquid so that the first metal and the second metal form at least one intermetallic compound having a higher re-melting temperature than the melting temperature of the metallic liquid, wherein the intermetallic compound is a connecting layer between the substrate and the semiconductor chips.