公开(公告)号：US20200211763A1

公开(公告)日：2020-07-02

申请号：US16479629

申请日：2018-03-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KEITO KATAOKA ,  HIDEKI UEDA

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/32

Abstract: An inductor component includes a package, a coil embedded in the package, a first external electrode extending from a first end of the coil, and a second external electrode extending from a second end of the coil. The package has a bottom surface, a top surface, first and second side surfaces opposite to each other, and third and fourth side surfaces opposite to each other. The bottom surface of the package has a first step recess therein sinking toward the top surface, opening to the third side surface, and contacting the first external electrode. The bottom surface of the package further has a second step recess therein sinking toward the top surface, opening to the fourth side surface, and contacting the second external electrode. The bottom surface has a third step recess therein connected to the first step recess and sinking toward the top surface. The bottom surface has a fourth step recess therein connected to the second step recess and sinking toward the top surface. Upon being subjected to reflow-soldering, the inductor component enhances wettability to solder.