PATTERN FORMING METHOD AND DEVICE
    1.
    发明申请

    公开(公告)号:US20190176376A1

    公开(公告)日:2019-06-13

    申请号:US16205172

    申请日:2018-11-29

    Abstract: A method and a device for forming a pattern improve transfer accuracy by reducing the number of fine bubbles remaining in a transfer material, and the number of bubbles that remain in a pattern when the pressure application on a film is finished before the transfer material completely fills the mold pattern. The method and a device include: filling a pattern of a mold with a transfer material by applying an ultrasonic vibration to the transfer material; and transferring the transfer material filling the pattern to a transfer target.

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