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公开(公告)号:US20190176376A1
公开(公告)日:2019-06-13
申请号:US16205172
申请日:2018-11-29
Inventor: MICHIRU KUROMIYA , AKIHIRO ISHIKAWA
Abstract: A method and a device for forming a pattern improve transfer accuracy by reducing the number of fine bubbles remaining in a transfer material, and the number of bubbles that remain in a pattern when the pressure application on a film is finished before the transfer material completely fills the mold pattern. The method and a device include: filling a pattern of a mold with a transfer material by applying an ultrasonic vibration to the transfer material; and transferring the transfer material filling the pattern to a transfer target.