公开(公告)号：US20170028772A1

公开(公告)日：2017-02-02

申请号：US15291147

申请日：2016-10-12

Applicant: Panduit Corp.

Inventor： James R. Ward ,  Mark B. Richardson ,  Anthony G. Smith, SR.

IPC: B44B5/02

CPC classification number: B44B5/024

Abstract: A marker plate embossing system is provided having an improved loading device, and improved chute and hopper systems. The loading device reduces the likelihood of marker plate misfeed. The chute and hopper systems allow the embossing of varying sized embossing plates, while reducing the likelihood of embossed marker plates being delivered in an incorrect stacked-order. A marker plate removal system is also provided for removing embossed marker plates from the hopper system without the marker plates falling out of the stacked-order.

Abstract translation: 提供了具有改进的装载装置和改进的滑槽和料斗系统的标记板压花系统。 装载装置降低了卡纸卡纸的可能性。 滑槽和料斗系统允许对不同尺寸的压花板进行压花，同时减少浮雕标记板以不正确的堆叠顺序传送的可能性。 还提供了标记板移除系统，用于从料斗系统中移除压花标记板，而不会使标记板从堆叠顺序中脱落。