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公开(公告)号：US20170091513A1
公开(公告)日：2017-03-30
申请号：US15378897
申请日：2016-12-14
Applicant: QUALCOMM Incorporated
Inventor： Richard S. Withers , Ronald B. Koo , Stephen C. Gerber , Arkadii V. Samoilov , David Johnson
CPC classification number: G06K9/0002 , G01R27/2605 , G02F1/13338 , G06F3/017 , G06K9/00053 , H01L27/323 , H01L51/5237
Abstract: A fingerprint sensor is described that includes a thin protective cover layer on a sensor glass layer with receive circuitry between the thin protective cover layer and the sensor glass layer. In an implementation, a fingerprint sensor assembly includes a controller; a metal layer configured to be electrically coupled to the controller; a transmit layer electrically connected to the metal layer and the controller; a sensor glass layer, where the transmit layer is disposed on a first side of the sensor glass layer, and where the transmit layer is electrically coupled to the controller; a receive layer disposed on a second side of the sensor glass layer, where the receive layer is electrically coupled to the controller; and a protective cover layer disposed on the receive layer.
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公开(公告)号：US09558390B2
公开(公告)日：2017-01-31
申请号：US14496073
申请日：2014-09-25
Applicant: QUALCOMM Incorporated
Inventor： Richard S. Withers , Ronald B. Koo , Stephen C. Gerber , Arkadii V. Samoilov , David Johnson
CPC classification number: G06K9/0002 , G01R27/2605 , G02F1/13338 , G06F3/017 , G06K9/00053 , H01L27/323 , H01L51/5237
Abstract: A fingerprint sensor is described that includes a thin protective cover layer on a sensor glass layer with receive circuitry between the thin protective cover layer and the sensor glass layer. In an implementation, a fingerprint sensor assembly includes a controller; a metal layer configured to be electrically coupled to the controller; a transmit layer electrically connected to the metal layer and the controller; a sensor glass layer including at least one through-glass via, where the transmit layer is disposed on a first side of the sensor glass layer, and where the transmit layer is electrically coupled to the at least one through-glass via; a receive layer disposed on a second side of the sensor glass layer, where the receive layer is electrically coupled to the at least one through-glass via; and a protective cover layer disposed on the receive layer.
Abstract translation: 描述了一种指纹传感器，其在传感器玻璃层上包括薄的保护性覆盖层，在薄的保护覆盖层和传感器玻璃层之间具有接收电路。 在实现中，指纹传感器组件包括控制器; 被配置为电耦合到所述控制器的金属层; 电连接到所述金属层和所述控制器的发射层; 传感器玻璃层，其包括至少一个透明玻璃通孔，其中所述透射层设置在所述传感器玻璃层的第一侧上，并且所述透射层电耦合到所述至少一个透玻璃通孔; 接收层，设置在所述传感器玻璃层的第二侧上，其中所述接收层电耦合到所述至少一个透玻璃通孔; 以及设置在接收层上的保护覆盖层。
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公开(公告)号：US10268864B2
公开(公告)日：2019-04-23
申请号：US15378897
申请日：2016-12-14
Applicant: QUALCOMM Incorporated
Inventor： Richard S. Withers , Ronald B. Koo , Stephen C. Gerber , Arkadii V. Samoilov , David Johnson
Abstract: A fingerprint sensor is described that includes a thin protective cover layer on a sensor glass layer with receive circuitry between the thin protective cover layer and the sensor glass layer. In an implementation, a fingerprint sensor assembly includes a controller; a metal layer configured to be electrically coupled to the controller; a transmit layer electrically connected to the metal layer and the controller; a sensor glass layer, where the transmit layer is disposed on a first side of the sensor glass layer, and where the transmit layer is electrically coupled to the controller; a receive layer disposed on a second side of the sensor glass layer, where the receive layer is electrically coupled to the controller; and a protective cover layer disposed on the receive layer.
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