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公开(公告)号：US20150155620A1
公开(公告)日：2015-06-04
申请号：US14185239
申请日：2014-02-20
Applicant: Quanta Computer Inc.
Inventor： Shuenn-Shyan Chen
Abstract: A wireless communication module is disclosed. A circuit board includes a first sidewall, a second sidewall, and a third sidewall. The second sidewall is perpendicular to and connected between the first and third sidewalls. Multiple interlayer traces are formed in the circuit board. An antenna integrated circuit is disposed on the second sidewall of the circuit board and is connected to the interlayer traces. An antenna is formed on the first sidewall of the circuit board. One of the interlayer traces is connected between the antenna integrated circuit and the antenna. At least one external solder pad is formed on the third sidewall of the circuit board. Another one of the interlayer traces is connected between the antenna integrated circuit and the external solder pad.
Abstract translation: 公开了一种无线通信模块。 电路板包括第一侧壁，第二侧壁和第三侧壁。 第二侧壁垂直于并连接在第一和第三侧壁之间。 在电路板中形成多个层间迹线。 天线集成电路设置在电路板的第二侧壁上并连接到层间迹线。 天线形成在电路板的第一侧壁上。 层间迹线之一连接在天线集成电路和天线之间。 在电路板的第三侧壁上形成至少一个外部焊盘。 层间迹线中的另一个连接在天线集成电路和外部焊盘之间。
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公开(公告)号：US11609255B1
公开(公告)日：2023-03-21
申请号：US17708463
申请日：2022-03-30
Applicant: Quanta Computer Inc.
Inventor： Shuenn-Shyan Chen , Te-Wei Liu
Abstract: A shielding box for testing a transmission antenna and a reception antenna includes a first box, a second box, a third box, and an absorption material. The transmission antenna is positioned in the first box. The reception antenna is positioned in the third box. The absorption material is distributed over the inner surfaces of the first box, the second box, and the third box, respectively. The third box is connected through the second box to the first box. The second box provides a relatively narrow connection path for reducing the multipath interference between the transmission antenna and the reception antenna.
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公开(公告)号：US09142885B2
公开(公告)日：2015-09-22
申请号：US14185239
申请日：2014-02-20
Applicant: Quanta Computer Inc.
Inventor： Shuenn-Shyan Chen
Abstract: A wireless communication module is disclosed. A circuit board includes a first sidewall, a second sidewall, and a third sidewall. The second sidewall is perpendicular to and connected between the first and third sidewalls. Multiple interlayer traces are formed in the circuit board. An antenna integrated circuit is disposed on the second sidewall of the circuit board and is connected to the interlayer traces. An antenna is formed on the first sidewall of the circuit board. One of the interlayer traces is connected between the antenna integrated circuit and the antenna. At least one external solder pad is formed on the third sidewall of the circuit board. Another one of the interlayer traces is connected between the antenna integrated circuit and the external solder pad.
Abstract translation: 公开了一种无线通信模块。 电路板包括第一侧壁，第二侧壁和第三侧壁。 第二侧壁垂直于并连接在第一和第三侧壁之间。 在电路板中形成多个层间迹线。 天线集成电路设置在电路板的第二侧壁上并连接到层间迹线。 天线形成在电路板的第一侧壁上。 层间迹线之一连接在天线集成电路和天线之间。 在电路板的第三侧壁上形成至少一个外部焊盘。 层间迹线中的另一个连接在天线集成电路和外部焊盘之间。
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