公开(公告)号：US20140265741A1

公开(公告)日：2014-09-18

申请号：US13795594

申请日：2013-03-12

Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.

Inventor： Zoran Vrankovic ,  Rongjun Huang ,  Mark Cooper ,  David M. Brod

IPC: H02K11/00

CPC classification number: H02K11/0094 ,  H02K11/25 ,  H02K11/33

Abstract: A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.

Abstract translation: 用于监测电动机驱动器中的电力电子设备的温度的系统包括限定平面的基板，电机驱动器内的电子设备和/或电路板可以安装在该平面上。 功率电子器件通过直接接合铜（DBC）安装到基板上。 电路板安装在基板上，该基板包括安装在靠近电力电子设备的电路板上的温度传感器。 温度传感器产生对应于由传感器测量的温度的数字信号。 电路板的各层之间以及电路板的第一层和传感器之间包括铜焊盘。 电路板还包括延伸穿过板的每一层的通孔。 铜焊盘和通孔在温度传感器和基板之间建立导热路径。

公开(公告)号：US20250055396A1

公开(公告)日：2025-02-13

申请号：US18231062

申请日：2023-08-07

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Jonathan D. Hoffman ,  Patrick E. Ozimek ,  Mark R. Cooper ,  Kevin J. Riederer ,  John Sandell ,  David M. Brod

IPC: H02P21/20 ,  H02P21/16 ,  H02P27/06

Abstract: A motor controller executes an axis module for each of multiple motors coupled to a shared load. A first control module passes at least one state variable to a second control module without experiencing communication delays between the axis modules. In order to decouple interaction between axes, the first control module determines the desired state variable at a periodic update rate and stores the desired state variable in memory. The first control module provides an indication to the second control module that the desired state variable is available. Within the same period at which the desired state variable is determined, the second control module receives the indication that the desired state variable is available and reads the state variable from the memory of the controller. The second control module executes using the desired state variable to reduce coupling between the two control modules.

公开(公告)号：US08829839B1

公开(公告)日：2014-09-09

申请号：US13795594

申请日：2013-03-12

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Zoran Vrankovic ,  Rongjun Huang ,  Mark Cooper ,  David M. Brod

IPC: H02P31/00 ,  H02P7/00 ,  H02K11/00

CPC classification number: H02K11/0094 ,  H02K11/25 ,  H02K11/33

Abstract: A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.

Abstract translation: 用于监测电动机驱动器中的电力电子设备的温度的系统包括限定平面的基板，电机驱动器内的电子设备和/或电路板可以安装在该平面上。 功率电子器件通过直接接合铜（DBC）安装到基板上。 电路板安装在基板上，该基板包括安装在靠近电力电子设备的电路板上的温度传感器。 温度传感器产生对应于由传感器测量的温度的数字信号。 电路板的各层之间以及电路板的第一层和传感器之间包括铜焊盘。 电路板还包括延伸穿过板的每一层的通孔。 铜焊盘和通孔在温度传感器和基板之间建立导热路径。

公开(公告)号：US20140354206A1

公开(公告)日：2014-12-04

申请号：US14459542

申请日：2014-08-14

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Zoran Vrankovic ,  Rongjun Huang ,  Mark Cooper ,  David M. Brod

IPC: H02K11/00

CPC classification number: H02K11/0094 ,  H02K11/25 ,  H02K11/33

Abstract: A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.