公开(公告)号：US20210305142A1

公开(公告)日：2021-09-30

申请号：US17264231

申请日：2019-08-12

Applicant: Rambus Inc.

Inventor： Shahram NIKOUKARY ,  Jonghyun CHO ,  Nitin JUNEJA ,  Ming LI

IPC: H01L23/498

Abstract: Disclosed is an integrated circuit die of a memory buffer integrated circuit that is placed aggregately closer to the solder balls that connect to the input (i.e., host command/address—C/A) signals than the output solder balls (i.e., memory device C/A) signals. This decreases the length of the host C/A signals from the memory controller to the memory buffer device when the memory module is placed in a system.

公开(公告)号：US20230420356A1

公开(公告)日：2023-12-28

申请号：US18218280

申请日：2023-07-05

Applicant: Rambus Inc.

Inventor： Shahram NIKOUKARY ,  Jonghyun CHO ,  Nitin JUNEJA ,  Ming LI

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49816

Abstract: Disclosed is an integrated circuit die of a memory buffer integrated circuit that is placed aggregately closer to the solder balls that connect to the input (i.e., host command/address—C/A) signals than the output solder balls (i.e., memory device C/A) signals. This decreases the length of the host C/A signals from the memory controller to the memory buffer device when the memory module is placed in a system.