公开(公告)号：US20140110047A1

公开(公告)日：2014-04-24

申请号：US13844801

申请日：2013-03-16

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Min-Woo LEE ,  Nakcho CHOI ,  DAEHO SONG ,  WooJae LEE

IPC: B32B37/10

CPC classification number: B32B37/10 ,  B32B38/1841 ,  B32B38/1858 ,  B32B2307/546 ,  B32B2457/20 ,  Y10T156/10 ,  Y10T156/1744

Abstract: A bonding apparatus configured to bond a component on a substrate is presented. The apparatus includes a stage, a push member, a support member and a compression member. The stage fixes the substrate in place and by using at least one first suction part formed in the stage. The push member is disposed above the stage and pushes the substrate fixed to the stage to support the substrate on the stage. At least one second suction part is formed in the support member to attach to a pad part of the substrate. The compression member compresses the component into the pad part fixed to the support member.

Abstract translation: 提供了一种被配置为将基底上的组分结合的接合装置。 该装置包括平台，推动构件，支撑构件和压缩构件。 该台将衬底固定就位并且通过使用形成在该台中的至少一个第一抽吸部件。 推动构件设置在平台上方并推动固定到台架上的基板，以将基板支撑在平台上。 在支撑构件中形成至少一个第二抽吸部分以附接到衬底的衬垫部分。 压缩构件将组件压缩成固定到支撑构件的衬垫部分。