公开(公告)号：US20220167502A1

公开(公告)日：2022-05-26

申请号：US17189756

申请日：2021-03-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk LEE ,  Young Ook CHO ,  Eun Sun KIM ,  Young Hun YOU

IPC: H05K1/11

Abstract: A printed circuit board includes: a first insulating layer; a via pad including a first layer embedded in the first insulating layer and a second layer disposed on the first layer; and a first via layer disposed on the via pad, wherein the second layer has a width decreasing in a direction away from the first layer in a stacking direction of the first and second layers.

公开(公告)号：US20250048534A1

公开(公告)日：2025-02-06

申请号：US18666110

申请日：2024-05-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Uk LEE ,  Myong Keun JUNG ,  Young Hun YOU

IPC: H05K1/02 ,  H05K1/11

Abstract: The present disclosure relates to a printed circuit board, including: an interconnect bridge including an insulating material, a plurality of conductive pattern layers respectively disposed on or in the insulating material, and a conductive post disposed on the insulating material; a first insulating layer embedding the interconnect bridge and having a recess portion exposing a portion of the conductive post; and a first wiring layer disposed on the first insulating layer and including a first pad pattern connected to the exposed portion of the conductive post on the recess portion.

公开(公告)号：US20220322528A1

公开(公告)日：2022-10-06

申请号：US17475747

申请日：2021-09-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun Sun KIM ,  Jin Uk LEE ,  Young Hun YOU

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/09 ,  H05K1/02

Abstract: A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.