公开(公告)号：US20180294280A1

公开(公告)日：2018-10-11

申请号：US15913530

申请日：2018-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ha-young KIM ,  Chang-beom KIM ,  Hyun-jeong ROH ,  Tae-joong SONG ,  Dal-hee LEE ,  Sung-we CHO

IPC: H01L27/118 ,  H01L27/02

Abstract: An integrated circuit includes a first conductive pattern in a first conductive layer, a second conductive pattern in a second conductive layer over the first conductive layer, and a via electrically connected with the first conductive pattern and the second conductive pattern to allow a first current flowing from the first conductive pattern to the second conductive pattern and a second current flowing from the second conductive pattern to the first conductive pattern to pass through at different times. The via is placed on the first conductive pattern so that a path of the first current does not overlap with a path of the second current in the first conductive pattern.