公开(公告)号：US20230146983A1

公开(公告)日：2023-05-11

申请号：US17983394

申请日：2022-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonjun JEONG ,  Jihyung LEE ,  Minki CHO ,  Kihuk LEE

IPC: H04N5/225 ,  G02B7/02 ,  G03B30/00

CPC classification number: H04N5/2253 ,  G02B7/021 ,  G03B30/00 ,  H04N5/2252

Abstract: An electronic device includes a housing and a camera module in the housing. The camera module includes a camera housing, a lens assembly disposed in the camera housing, an image sensor disposed in the camera housing and at least partially aligned with an optical axis of the lens, a metal plate including a first area that overlaps the image sensor when viewed in a direction of the optical axis and a second area around the first area, and a circuit board at least partially attached to the metal plate and electrically connected with the image sensor. A slit that penetrates the metal plate or a recess concavely defined in a surface of the metal plate is defined in the second area of the metal plate.