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公开(公告)号：US12250798B2
公开(公告)日：2025-03-11
申请号：US17975169
申请日：2022-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Haein Chung , Kyungha Koo , Kangsik Kim , Wonmin Kim
Abstract: An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.
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