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公开(公告)号：US20220021794A1
公开(公告)日：2022-01-20
申请号：US17336931
申请日：2021-06-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunsu Jun , Kihyun Kwon , Seunghak Lee
IPC: H04N5/225
Abstract: A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.
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Patent Agency Ranking
公开(公告)号：US11451696B2
公开(公告)日：2022-09-20
申请号：US16914389
申请日：2020-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kihyun Kwon , Gunwoo Ryu , Euncheol Lee
Abstract: A semiconductor memory device includes a pixel array having pixels, a logic circuit configured to process a signal output by the pixels to generate image data, and sensor pads connected to the logic circuit, where the sensor pads include a first ground sensor pad, a second ground sensor pad, signal sensor pads disposed between the first ground sensor pad and the second ground sensor pad and configured to output the image data, and dummy sensor pads disposed between the first ground sensor pad and the second ground sensor pad and configured not to output the image data, and at least one of the dummy sensor pads is disposed between the signal sensor pads.
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公开(公告)号：US20210099626A1
公开(公告)日：2021-04-01
申请号：US16867109
申请日：2020-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kihyun Kwon , Seunghak Lee , Jihyung Lim
Abstract: An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.
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公开(公告)号：US11563874B2
公开(公告)日：2023-01-24
申请号：US17570500
申请日：2022-01-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunsu Jun , Kihyun Kwon , Seunghak Lee
IPC: H04N5/225
Abstract: A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.
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公开(公告)号：US11570344B2
公开(公告)日：2023-01-31
申请号：US16867109
申请日：2020-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kihyun Kwon , Seunghak Lee , Jihyung Lim
Abstract: An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.
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公开(公告)号：US11252308B2
公开(公告)日：2022-02-15
申请号：US17336931
申请日：2021-06-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunsu Jun , Kihyun Kwon , Seunghak Lee
IPC: H04N5/225
Abstract: A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.
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