公开(公告)号：US12266674B2

公开(公告)日：2025-04-01

申请号：US17315321

申请日：2021-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minho Jang ,  Kyoungwon Na ,  Seungkuk Kang ,  Hyunchul Kim ,  Hyun Young Yeo ,  In Sung Joe

IPC: H01L27/146

Abstract: An image sensor includes a first chip that includes a pixel region and a pad region, and a second chip that is in contact with one surface of the first chip and includes circuits that drive the first chip. The first chip includes a first substrate, an interlayer insulating layer disposed between the first substrate and the second chip, first interconnection lines disposed in the interlayer insulating layer, a conductive pad disposed in the pad region between the second chip and the first interconnection lines, and a recess region formed in the pad region that penetrates the first substrate and the interlayer insulating layer and exposes the conductive pad.