公开(公告)号：US20210012465A1

公开(公告)日：2021-01-14

申请号：US16924354

申请日：2020-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomjoon KIM ,  Minjae LEE ,  Youngseok HAN

IPC: G06T5/00 ,  G06T7/40 ,  G06T5/50

Abstract: An electronic device is provided. The electronic device includes an input interface and a processor that performs noise removal processing on an image input through the input interface, obtains first information on a first texture block among a plurality of first pixel blocks included in the input image, obtains second information on a second texture block among a plurality of second pixel blocks included in the noise-removed image, obtains third information on maximum energy amount among energy amount of each of the plurality of second pixel blocks, and identifies whether the input image is an upscaled image based on the first, second and third information.

公开(公告)号：US20230011062A1

公开(公告)日：2023-01-12

申请号：US17673416

申请日：2022-02-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaerin LEE ,  Minjae LEE ,  Sewon LEE ,  Kyeongkeun KANG

IPC: H03M1/10

Abstract: An analog-to-digital converter is provided. The analog-to-digital converter includes: a sample/hold circuit; a digital-to-analog converter; a plurality of comparison circuits; a control logic; and a digital register, wherein the plurality of comparison circuits include: a first comparison circuit configured to output a first comparison result signal in a first operation period; a second comparison circuit configured to, in a second operation period, calibrate an offset of a second comparison result signal based on a reference signal corresponding to the first comparison result signal among a plurality of reference signals and output the calibrated second comparison result signal; and a third comparison circuit configured to, in a third operation period, calibrate an offset of a third comparison result signal based on a reference signal corresponding to the calibrated second comparison result signal and output the calibrated third comparison result signal.

公开(公告)号：US20230139117A1

公开(公告)日：2023-05-04

申请号：US18148336

申请日：2022-12-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyumin KOH ,  Gyeongjin KIM ,  Minjae LEE

IPC: H05B6/64 ,  A47J37/06

Abstract: A cooking apparatus comprises a cooking chamber in which a food is cooked and opened in a first direction, a heater arranged at a side of the cooking chamber and configured to provide heat into the cooking chamber, a magnetron configured to generate a high frequency supplied into the cooking chamber, and a folding shelf detachably mounted in the cooking chamber and configured to be foldable. The folding shelf extends in a second direction to support the food at a first mounting position, and while the folding shelf is in a folded state, the folding shelf configured to divide the cooking chamber into a plurality of cooking spaces at a second mounting position.

公开(公告)号：US20230084124A1

公开(公告)日：2023-03-16

申请号：US17991024

申请日：2022-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghee KIM ,  Byunghun HAN ,  Hyeongmo KANG ,  Donghyeon NA ,  Dougyong SUNG ,  Seungbo SHIM ,  Minjae LEE ,  Myungsun CHOI ,  Minyoung HUR

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/3065 ,  H03H7/38

Abstract: A plasma etching method and a semiconductor device fabrication method, the plasma etching method including providing a source power having a first single pulse to an electrostatic chuck in order to generate a plasma on a substrate; providing a first bias power having a burst pulse different from the first single pulse to concentrate the plasma on the substrate; and providing a second bias power having a second single pulse the same as the first single pulse to accelerate the plasma toward the substrate.

公开(公告)号：US20210104382A1

公开(公告)日：2021-04-08

申请号：US16891157

申请日：2020-06-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghee KIM ,  Byunghun HAN ,  Hyeongmo KANG ,  Donghyeon NA ,  Dougyong SUNG ,  Seungbo SHIM ,  Minjae LEE ,  Myungsun CHOI ,  Minyoung HUR

IPC: H01J37/32 ,  H03H7/38 ,  H01L21/683 ,  H01L21/3065

Abstract: A plasma etching method and a semiconductor device fabrication method, the plasma etching method including providing a source power having a first single pulse to an electrostatic chuck in order to generate a plasma on a substrate; providing a first bias power having a burst pulse different from the first single pulse to concentrate the plasma on the substrate; and providing a second bias power having a second single pulse the same as the first single pulse to accelerate the plasma toward the substrate.

公开(公告)号：US20220322501A1

公开(公告)日：2022-10-06

申请号：US17671138

申请日：2022-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiho JEONG ,  Minjae LEE

IPC: H05B6/64

Abstract: Disclosed herein is a cooking apparatus. The cooking apparatus includes a housing, a cooking chamber formed in the housing, a heater arranged on one side of the cooking chamber, a door coupled to the housing to open and close the cooking chamber, the door including a door body provided to form an exterior of the door, a handle recessed from an outer surface of the door body, and a cooling plate positioned adjacent to an inner surface of the door body corresponding to the handle so as to dissipate heat that is generated by the heater and transferred to the handle.