公开(公告)号：US20250031507A1

公开(公告)日：2025-01-23

申请号：US18905645

申请日：2024-10-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho LIM ,  Myoungsu CHAE ,  Yeonjun SUNG ,  Hyongsik WON ,  Joonwoo JEON ,  Soonwon JEONG

IPC: H01L33/62 ,  H05K1/11

Abstract: A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.