公开(公告)号：US20220285290A1

公开(公告)日：2022-09-08

申请号：US17750903

申请日：2022-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungwook KIM ,  Ayoung KIM ,  Seongwon JEONG ,  Sangsu HA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.

公开(公告)号：US20210050308A1

公开(公告)日：2021-02-18

申请号：US16810091

申请日：2020-03-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungwook KIM ,  Ayoung KIM ,  Seongwon JEONG ,  Sangsu HA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.