公开(公告)号：US20190157237A1

公开(公告)日：2019-05-23

申请号：US16057323

申请日：2018-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Je LEE ,  Seunglo LEE ,  Sungil CHO ,  Hosoo HAN

IPC: H01L23/00

Abstract: A semiconductor device includes a first device having a first pad; a second device having a second pad; and a bonding wire electrically connecting the first device and the second device to each other via the first pad and the second pad. The bonding wire includes: a first bonding structure provided at a first end of the bonding wire, electrically connected to the first device and includes: a first ball bonding region; and a first stitch bonding region; and a second bonding structure provided at a second end opposite of the first end of the bonding wire and electrically connected to the second device.