公开(公告)号：US20230164255A1

公开(公告)日：2023-05-25

申请号：US17992543

申请日：2022-11-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangha SHIN ,  Suk KIM

IPC: H04M1/02 ,  H05K1/18

CPC classification number: H04M1/0277 ,  H05K1/189 ,  H04M1/0264 ,  H04M1/0262

Abstract: An electronic device including a housing; a first printed circuit board disposed in the housing; a second printed circuit board disposed in the housing; a flexible printed circuit board configured to electrically connect the first printed circuit board to the second printed circuit board, the flexible printed circuit board including: a first connector connected to the first printed circuit board, a second connector connected to the second printed circuit board, and a bending part which extends from the first connector away from the second printed circuit board and bends to extend toward the second printed circuit board; an electrical component disposed in the housing, wherein at least a portion of the electrical component faces the flexible printed circuit board; and a buffer member disposed between a first portion of the bending part and a second portion of the bending part which faces the first portion of the bending part.