公开(公告)号：US11428385B2

公开(公告)日：2022-08-30

申请号：US17379530

申请日：2021-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongsoo Lim ,  Chinwoo Kim ,  Yongchul Kang ,  Heejin Kim ,  Jeongje Moon ,  Jaeyoo Jeong ,  Jun Cho ,  Jongwook Ju

IPC: F21V14/00 ,  F21V33/00 ,  F21Y115/10

Abstract: Provided is a light source module including a package body having a groove portion, a semiconductor light emitting diode (LED) chip provided on a bottom surface of the groove portion, the semiconductor LED chip being configured to emit light based on a first driving voltage applied thereto, a variable light transmission unit provided on the groove portion and having light transmissivity varying based on a second driving voltage applied thereto, a first electrode side surface and a second electrode side surface provided on side surfaces of the groove portion and connecting the bottom surface of the groove portion to the variable light transmission unit, and a processor configured to control application of the first driving voltage to the semiconductor LED chip and the second driving voltage to the variable light transmission unit.