公开(公告)号：US3815191A

公开(公告)日：1974-06-11

申请号：US26869072

申请日：1972-07-03

Applicant: SANDVIK AB

Inventor： HOLMA J

IPC: B23B27/04 ,  B23B27/14 ,  B26D1/00

CPC classification number: B23B27/143 ,  B23B27/045 ,  B23B2200/323 ,  Y10T407/235 ,  Y10T407/245 ,  Y10T407/25

Abstract: In a chip-forming machining operation improved results accrue from imparting to the chip - in the course of its formation - a longitudinally extending bulge or thickened portion which significantly stiffens the chip and desirably modifies its form. Locating the bulge adjacent the central part of the chip influences a ring-shaped form of chip, while locating the bulge adjacent an edge of the chip results in a cylindrical form of chip having a fairly constant radius of curvature and a great relatively constant pitch. The cutting tool which provides this stiffened chip has a groove or concavity at the locus where the thickened portion of the chip is desired.

Abstract translation: 在切屑成形加工操作中，由于赋予芯片 - 在其形成过程中产生增加的结果 - 纵向延伸的凸起或加厚部分，其显着地硬化芯片并且期望地改变其形状。 定位邻近芯片的中心部分的凸起影响环形形式的芯片，同时将邻近边缘的凸起定位成具有相当恒定的曲率半径和相当恒定间距的圆柱形芯片。 提供该加强芯片的切削工具在需要加厚部分的轨迹处具有凹槽或凹陷。