公开(公告)号：US20170263581A1

公开(公告)日：2017-09-14

申请号：US15506286

申请日：2015-08-18

Applicant: SONY CORPORATION

Inventor： KUNIHIKO SARUTA ,  HIROSHI OZAKI ,  HIDETOSHI KABASAWA

IPC: H01L23/00 ,  H01L23/498 ,  B81B7/00 ,  H01L23/31 ,  H01L25/065 ,  H01L27/146

Abstract: [Object] To provide an electronic device, a part mounting board, and an electronic apparatus that are capable of preventing warpage of a board from occurring. [Solving Means] An electronic device according to an embodiment of the present technology includes a first circuit board and a second circuit board. The first circuit board includes a first main surface, a second main surface, and a plurality of external terminals. The plurality of external terminals include a first terminal group located at an outermost periphery of the first main surface, and are arranged on the first main surface in a matrix pattern. The second circuit board includes a terminal surface facing the second main surface, and a plurality of connection terminals. The plurality of connection terminals include a second terminal group that is arranged on the terminal surface and faces at least a part of the first terminal group, and are electrically connected to the second main surface.