公开(公告)号：US20180366385A1

公开(公告)日：2018-12-20

申请号：US16072410

申请日：2017-01-25

Applicant: SONY CORPORATION

Inventor： MITSUO HASHIMOTO ,  AKIRA AKIBA ,  HIDETOSHI KABASAWA

IPC: H01L23/15 ,  H01L27/146 ,  H01L23/29 ,  H01L23/31 ,  H01L31/0203 ,  H01L23/00

Abstract: The present disclosure relates to a glass interposer module, an imaging device, and an electronic apparatus capable of reducing occurrence of distortion caused by thermal expansion during manufacture. A light transmissive member is charged between a glass interposer and a CMOS image sensor (CIS). Since rigidity of the glass interposer can be enhanced by this configuration, it is possible to suppress deflection of the CIS and also reduce influence of distortion given to a gyro sensor and the like which are equipped on the glass interposer, and therefore, erroneous detection of a gyro signal can be reduced. The present disclosure can be applied to a glass interposer module.