公开(公告)号：US20220139845A1

公开(公告)日：2022-05-05

申请号：US17509758

申请日：2021-10-25

Applicant: STMICROELECTRONICS, INC.

Inventor： Endalicio MANALO ,  Rennier RODRIGUEZ

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/29 ,  H01L23/31

Abstract: The present disclosure is directed to a semiconductor package that include a non-conductive encapsulation layer encapsulation an integrated circuit chip, and a conductive encapsulation layer over the non-conductive encapsulation layer. A lead is exposed from the non-conductive encapsulation layer and contacts the conductive encapsulation layer. The conductive encapsulation layer and the lead provide EMI shielding for the integrated circuit chip.