公开(公告)号：US20240170451A1

公开(公告)日：2024-05-23

申请号：US18504895

申请日：2023-11-08

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Come De Buttet ,  Damien Jeanjean ,  Sebastien Mermoz ,  Marc Neyens

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/08 ,  H01L2224/08145 ,  H01L2224/83047 ,  H01L2224/83895 ,  H01L2224/83896

Abstract: According to one aspect, there is proposed a method for assembling two integrated circuit wafers. The method includes removing by abrasion of a portion of an assembly face of a first wafer on a perimeter of the first wafer, and bonding the assembly face of the first wafer to an assembly face of a second integrated circuit wafer.

公开(公告)号：US12243895B2

公开(公告)日：2025-03-04

申请号：US17211739

申请日：2021-03-24

Applicant: STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Thierry Berger ,  Marc Neyens ,  Audrey Vandelle Berthoud ,  Marc Guillermet ,  Philippe Brun

IPC: H01L27/146

Abstract: The present disclosure relates to a method for manufacturing a pixel by: depositing an insulating layer on an exposed face of an interconnect structure of an integrated circuit, the interconnect structure having a conductive element flush with said exposed face; etching an opening passing through the insulating layer to the conductive element; depositing an electrode layer on and in contact with the conductive element and the insulating layer; defining an electrode by removing, by etching, part of the electrode layer resting on the insulating layer; and depositing a film configured to convert photons into electron-hole pairs when a ray at an operating wavelength of the pixel reaches the pixel.