公开(公告)号：US20180374780A1

公开(公告)日：2018-12-27

申请号：US16007767

申请日：2018-06-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mauro MAZZOLA ,  Matteo DE SANTA ,  Battista VITALI

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A process for manufacturing a semiconductor flip chip package and a corresponding flip chip package. The process comprises associating conducting bump pads to a face corresponding to an active side of one or more electronic dice, flipping the one or more electronic dice so that said face corresponding to an active side of one or more electronic dies is facing a leadframe carrying contacting pads in correspondence of said conducting bump pads, bonding said contacting pads to said conducting bump pads and encasing said one or more electronic dice in a casing by a molding operation. The process includes providing a leadframe having contacting pads presenting a recessed surface in correspondence of the position of said conducting bump pads.