公开(公告)号：US09536756B1

公开(公告)日：2017-01-03

申请号：US14754143

申请日：2015-06-29

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Amor Zapanta

IPC: H01L21/00 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78

CPC classification number: H01L21/566 ,  H01L21/4825 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The sacrificial material may be removed by a blanket technique such that a mask, pattern, or alignment step is not needed. In one embodiment the sacrificial material is formed on the lead frame on a connecting bar of a lead frame between adjacent leads. After the molding step, the connecting bar is etched away exposing a surface of the sacrificial material. The sacrificial material is removed, thereby separating the assembled packages into individual packages.

Abstract translation: 一个或多个实施例涉及使用牺牲材料组装的半导体封装，当被移除时，将组装的封装分离成单个封装。 可以通过覆盖技术去除牺牲材料，使得不需要掩模，图案或对准步骤。 在一个实施例中，牺牲材料形成在引线框架上的相邻引线之间的引线框架的连接杆上。 在模制步骤之后，连接杆被蚀刻掉，暴露牺牲材料的表面。 去除牺牲材料，从而将组装的包装分离成单独的包装。

公开(公告)号：US20160379846A1

公开(公告)日：2016-12-29

申请号：US14754143

申请日：2015-06-29

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Amor Zapanta

IPC: H01L21/56 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L21/566 ,  H01L21/4825 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The sacrificial material may be removed by a blanket technique such that a mask, pattern, or alignment step is not needed. In one embodiment the sacrificial material is formed on the lead frame on a connecting bar of a lead frame between adjacent leads. After the molding step, the connecting bar is etched away exposing a surface of the sacrificial material. The sacrificial material is removed, thereby separating the assembled packages into individual packages.

Abstract translation: 一个或多个实施例涉及使用牺牲材料组装的半导体封装，当被移除时，将组装的封装分离成单个封装。 可以通过覆盖技术去除牺牲材料，使得不需要掩模，图案或对准步骤。 在一个实施例中，牺牲材料形成在引线框架上的相邻引线之间的引线框架的连接杆上。 在模制步骤之后，连接杆被蚀刻掉，暴露牺牲材料的表面。 去除牺牲材料，从而将组装的包装分离成单独的包装。