公开(公告)号：US20210111109A1

公开(公告)日：2021-04-15

申请号：US17131222

申请日：2020-12-22

Applicant: STMICROELECTRONICS, INC.

Inventor： Rennier RODRIGUEZ ,  Aiza Marie AGUDON ,  Maiden Grace MAMING

IPC: H01L23/495 ,  H01L23/64

Abstract: The present disclosure is directed to a flat no-lead semiconductor package with a surfaced mounted structure. An end portion of the surface mounted structure includes a recessed member so that the surface mounted structure is coupled to leads of the flat no-lead semiconductor package through, among others, the sidewalls of the recessed members.

公开(公告)号：US20210265245A1

公开(公告)日：2021-08-26

申请号：US17317818

申请日：2021-05-11

Applicant: STMicroelectronics, Inc.

Inventor： Rennier RODRIGUEZ ,  Maiden Grace MAMING ,  Jefferson TALLEDO

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

公开(公告)号：US20210151368A1

公开(公告)日：2021-05-20

申请号：US17139669

申请日：2020-12-31

Applicant: STMICROELECTRONICS, INC.

Inventor： Rennier RODRIGUEZ ,  Aiza Marie AGUDON ,  Maiden Grace MAMING

IPC: H01L23/495 ,  H01L23/64

Abstract: The present disclosure is directed to a flat no-lead semiconductor package with a surfaced mounted structure. An end portion of the surface mounted structure includes a recessed member so that the surface mounted structure is coupled to leads of the flat no-lead semiconductor package through, among others, the sidewalls of the recessed members.

公开(公告)号：US20230253213A1

公开(公告)日：2023-08-10

申请号：US18303471

申请日：2023-04-19

Applicant: STMicroelectronics, Inc.

Inventor： Rennier RODRIGUEZ ,  Maiden Grace MAMING ,  Jefferson Sismundo TALLEDO

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L23/49513 ,  H01L23/562 ,  H01L23/49548 ,  H01L24/29 ,  H01L23/49503 ,  H01L23/49541

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

公开(公告)号：US20190267310A1

公开(公告)日：2019-08-29

申请号：US16264824

申请日：2019-02-01

Applicant: STMicroelectronics, Inc.

Inventor： Rennier RODRIGUEZ ,  Maiden Grace MAMING ,  Jefferson TALLEDO

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.