公开(公告)号：US20190148271A1

公开(公告)日：2019-05-16

申请号：US16249612

申请日：2019-01-16

Applicant: STMicroelectronics, Inc.

Inventor： Rennier RODRIGUEZ ,  Raymond Albert NARVADEZ ,  Ernesto ANTILANO, JR.

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

Abstract: The present disclosure is directed to a leadframe package having leads with protrusions on an underside of the leadframe. The protrusions come in various shapes and sizes. The protrusions extend from a body of encapsulant around the leadframe to couple to surface contacts on a substrate. The protrusions have a recess that is filled with encapsulant. Additionally, the protrusions may be part of the lead or may be a conductive layer on the lead. In some embodiments a die pad of the leadframe supporting a semiconductor die also has a protrusion on the underside of the leadframe. The protrusion on the die pad has a recess that houses an adhesive and at least part of the semiconductor die. The die pad with a protrusion may include anchor locks at the ends of the die pad to couple to the encapsulant.

公开(公告)号：US20220005782A1

公开(公告)日：2022-01-06

申请号：US17479988

申请日：2021-09-20

Applicant: STMicroelectronics, Inc.

Inventor： Rennier RODRIGUEZ ,  Rammil SEGUIDO ,  Raymond Albert NARVADEZ ,  Michael TABIERA

IPC: H01L23/00 ,  H01L23/495

Abstract: The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.