公开(公告)号：US20240170451A1

公开(公告)日：2024-05-23

申请号：US18504895

申请日：2023-11-08

Applicant: STMicroelectronics (Crolles 2) SAS

Inventor： Come De Buttet ,  Damien Jeanjean ,  Sebastien Mermoz ,  Marc Neyens

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/08 ,  H01L2224/08145 ,  H01L2224/83047 ,  H01L2224/83895 ,  H01L2224/83896

Abstract: According to one aspect, there is proposed a method for assembling two integrated circuit wafers. The method includes removing by abrasion of a portion of an assembly face of a first wafer on a perimeter of the first wafer, and bonding the assembly face of the first wafer to an assembly face of a second integrated circuit wafer.