公开(公告)号：US20240413043A1

公开(公告)日：2024-12-12

申请号：US18207918

申请日：2023-06-09

Applicant: STMicroelectronics International N.V.

Inventor： Romain COFFY ,  Laurent Schwartz ,  Ludovic Fourneaud

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367

Abstract: Systems, apparatuses, and method for nanowires for semiconductor packages are provided herein. The semiconductor package may include die attached to a substrate. A lid may also be attached to the substrate. The die includes die nanowires and the lid includes lid nanowires. The nanowires may be formed over the entirety of the die or in a pattern. The lid may have a corresponding or symmetrical coverage or pattern. In the semiconductor package, the die nanowires and the lid nanowires are coupled to, among other things, provide improved heat dissipation.