公开(公告)号：US20240327203A1

公开(公告)日：2024-10-03

申请号：US18613746

申请日：2024-03-22

Applicant: STMicroelectronics International N.V.

Inventor： Mark Andrew SHAW ,  Fabio QUAGLIA ,  Domenico GIUSTI ,  Marco FERRERA

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00 ,  H01L25/18 ,  H10N39/00

CPC classification number: B81B7/007 ,  B81B3/007 ,  B81C1/00301 ,  B81C1/00658 ,  H01L25/18 ,  H10N39/00 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/096 ,  B81C2203/0792

Abstract: A method for manufacturing a MEMS device includes forming a first solid body by forming, on a substrate, a layered structure having a thickness of a value comprised between 4 and 10 μm, with the layered structure having a first surface that is uniformly flat or planar throughout the extension thereof that faces the substrate. The method further includes forming, on a second surface of the layered structure opposite to the first surface in a direction, multiple transducer devices. The method then proceeds with coupling the first solid body to a supporting structure, and completely removing the substrate to expose said uniformly flat or planar surface.