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公开(公告)号：US20250003819A1
公开(公告)日：2025-01-02
申请号：US18214892
申请日：2023-06-27
Applicant: STMicroelectronics International N.V.
Inventor： Massimiliano Pesaturo , Marco Omar Ghidoni , Mikel Azpeitia Urquia
Abstract: An ultra-compact stacked differential pressure sensor is provided, which includes a differential pressure sensor stacked on an ASIC stacked on a substrate. The differential pressure sensor is connected to the ASIC by an inner ring and outer ring. The region between the inner ring and outer ring forms an isolation region. The ASIC may be connected to the substrate with glue. Each of the ASIC and substrate may have a through hole channel and the differential pressure sensor may have a back channel. The differential pressure sensor is exposed to a first pressure on a first side and a second pressure via the differential pressure back channel, the ASIC channel, and the substrate channel. The differential pressure sensor may generate an electrical signal based on a difference in pressures between the first environment and the second environment.
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