公开(公告)号：US20250132781A1

公开(公告)日：2025-04-24

申请号：US18920542

申请日：2024-10-18

Applicant: STMicroelectronics International N.V.

Inventor： Samia Ouyahia ,  Eric Wilhelm

IPC: H04B1/40 ,  H03F3/19 ,  H03H7/38

Abstract: The present description relates to an electronic circuit having an impedance matching circuit comprising a first inductance coupling a first node to a second node, and a second inductance coupling the second node to a third node, the third node being coupled to ground. The first and second inductances are configured to form a positive magnetic coupling between each other.

公开(公告)号：US20230092413A1

公开(公告)日：2023-03-23

申请号：US17800299

申请日：2021-02-15

Applicant: STMicroelectronics International N.V.

Inventor： Renaud Lemoine ,  Samia Ouyahia ,  Eric Wilhelm ,  Christophe Boyavalle

IPC: H03F1/02 ,  H03F1/56 ,  H03F3/195 ,  H04B1/04

Abstract: According to one aspect, an integrated circuit having a radio frequency amplifier includes at least two amplifier stages and an impedance matching device between two amplifier stages of the radio frequency amplifier. The matching device includes two lines which are coupled by electromagnetic induction. The first line is connected to an output of the first amplifier stage and the second line is connected to an input of the second amplifier stage.