公开(公告)号：US20150130531A1

公开(公告)日：2015-05-14

申请号：US14079512

申请日：2013-11-13

Applicant: STMicroelectronics International N.V.

Inventor： Aswani Aditya Kumar TADINADA ,  Tanmoy SEN

IPC: G05F5/00

CPC classification number: G05F5/00 ,  G01K1/026 ,  G01K7/01

Abstract: An integrated circuit die includes multiple temperature sensor units each for measuring the temperature of respective regions of a semiconductor substrate of the integrated circuit die. The temperature sensor units are each coupled to a multiplexer by respective groups of signal lines. The signal lines include resistance compensation areas for maintaining a particular ratio of resistances of the signal lines of each group.

Abstract translation: 集成电路管芯包括多个温度传感器单元，每个温度传感器单元用于测量集成电路管芯的半导体衬底的相应区域的温度。 温度传感器单元各自通过相应的信号线组耦合到多路复用器。 信号线包括用于维持每组信号线的电阻的特定比率的电阻补偿区域。