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    MICROPRISM AND MICROLENS ARRAY FOR USE IN LIDAR SYSTEM
    1.
    发明公开
    MICROPRISM AND MICROLENS ARRAY FOR USE IN LIDAR SYSTEM 审中-公开

    公开(公告)号：US20240045030A1

    公开(公告)日：2024-02-08

    申请号：US17882173

    申请日：2022-08-05

    Applicant: STMicroelectronics S.r.l.

    Inventor： Antonio FINCATO

    IPC: G01S7/481 ,  G02B6/42 ,  G02B6/12 ,  G01S7/497

    CPC classification number: G01S7/4814 ,  G02B6/4214 ,  G02B6/12004 ,  G01S7/497 ,  G02B6/136

    Abstract: A LIDAR optical unit includes a photonic-integrated-circuit (PIC) affixed to a carrier. The PIC includes an input coupler and an array of output couplers, with a switchable optical network connecting the input coupler to different selected ones of the array of output couplers. A laser source is mounted to the PIC adjacent the input coupler such that laser light generated by the laser source is injected into the input coupler. An optical stack is mounted to the PIC adjacent the array of output couplers to receive laser light extracted from the switchable optical network by the array of output couplers. The optical stack includes an array of microlenses positioned so that a bottom surface thereof is mounted to the PIC, and an array of microprisms is stacked on the array of microlenses so that a bottom surface thereof is mounted to a top surface of the array of microlenses.

    OPTICAL DEMULTIPLEXER AND METHOD OF CONTROLLING AN OPTICAL DEMULTIPLEXER
    2.
    发明申请
    OPTICAL DEMULTIPLEXER AND METHOD OF CONTROLLING AN OPTICAL DEMULTIPLEXER 有权
    光学解复用器和控制光学解复用器的方法

    公开(公告)号：US20150263819A1

    公开(公告)日：2015-09-17

    申请号：US14635658

    申请日：2015-03-02

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Antonio FINCATO

    IPC: H04J14/02

    CPC classification number: H04J14/02 ,  G02B6/12007 ,  G02B6/29352 ,  G02B6/29395 ,  G02F1/21 ,  G02F2001/212 ,  H04J14/00

    Abstract: An optical demultiplexer includes an interleaver with at least four ports including a first port adapted to receive the sum of two optical signals A and B, a second port and a third port respectively for signals A and B, and a fourth port. The optical demultiplexer further includes an optical component coupled t at least one of the two ports for signals A and B and configured to split the optical signal to be outputted into a weak intensity optical signal and a strong intensity optical signal.

    Abstract translation: 光解复用器包括具有至少四个端口的交织器，包括适于接收两个光信号A和B的总和的第一端口，分别用于信号A和B的第二端口和第三端口以及第四端口。 光解复用器还包括耦合到用于信号A和B的两个端口中的至少一个端口的光学部件，并被配置为将要输出的光信号分离成弱强度光信号和强强度光信号。

    MULTI-SUBSTRATE ELECTRO-OPTICAL INTERCONNECTION SYSTEM
    3.
    发明申请
    MULTI-SUBSTRATE ELECTRO-OPTICAL INTERCONNECTION SYSTEM 有权
    多基板电光互连系统

    公开(公告)号：US20150341119A1

    公开(公告)日：2015-11-26

    申请号：US14714582

    申请日：2015-05-18

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Antonio FINCATO ,  Salvatore Mario Rotolo ,  Enrico Stefano Temporiti Milani ,  Maurizio Zuffada

    IPC: H04B10/40 ,  H04B10/50 ,  H05K3/30 ,  H04B10/70

    CPC classification number: H04B10/40 ,  H04B10/503 ,  H04B10/70 ,  H04B10/801 ,  H05K3/30 ,  Y10T29/49131

    Abstract: An intra-board chip-to-chip optical communications system has a high bit rate and high data throughput based on the use of a silicon photonic interposer. The system includes a multi-substrate electro-optical structure for communications with CMOS and/or BiCMOS IC chips of a PCB. The structure includes a multi-chip module primary substrate mounted over the supporting PCB. The multi-chip module primary substrate implements high frequency electrical interconnections between transceiver circuit chips, mounted on the silicon photonic interposer, and the IC chips.

    Abstract translation: 基于硅光子插入器的使用，片内芯片到芯片的光通信系统具有高比特率和高数据吞吐量。 该系统包括用于与PCB的CMOS和/或BiCMOS IC芯片通信的多基板电光结构。 该结构包括安装在支撑PCB上的多芯片模块主要基板。 多芯片模块主要基板在安装在硅光子插入器上的收发器电路芯片和IC芯片之间实现高频电互连。

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