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    Enhanced IC card
    1.
    发明授权
    Enhanced IC card 有权
    增强型IC卡

    公开(公告)号：US09235797B2

    公开(公告)日：2016-01-12

    申请号：US14665323

    申请日：2015-03-23

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Giuliano Filpi ,  Antonio Sismundo ,  Raffaele Caiazzo

    IPC: G06K19/077 ,  H01L21/56

    CPC classification number: G06K19/07739 ,  G06K19/0772 ,  H01L21/56

    Abstract: An IC card may include a substrate having opposing first and second surfaces, and a circuit carried by the substrate adjacent the first surface of the substrate. The substrate may include a first area defining a first sector of the substrate carrying the circuit and configured to be separated from the IC card, the first sector having a form and size based upon a first IC card format, the first area having a first line delimiting the first sector to the first IC card format. The substrate may include a second area defining a second sector around the first sector and configured to be separated from the IC card based upon a second line. The second sector may have a form and size based upon at least one of a second IC card format and a third IC card format.

    Abstract translation: IC卡可以包括具有相对的第一和第二表面的基板和与基板的第一表面相邻的基板承载的电路。 衬底可以包括限定承载电路并且被配置为与IC卡分离的衬底的第一扇区的第一区域，第一扇区具有基于第一IC卡格式的形式和尺寸，第一区域具有第一线 将第一扇区划分为第一个IC卡格式。 衬底可以包括限定围绕第一扇区的第二扇区的第二区域，并且被配置为基于第二线路与IC卡分离。 第二扇区可以具有基于第二IC卡格式和第三IC卡格式中的至少一个的形式和大小。

    Card packaging method, corresponding packaged card and method of use
    2.
    发明授权
    Card packaging method, corresponding packaged card and method of use 有权

    公开(公告)号：US11783153B2

    公开(公告)日：2023-10-10

    申请号：US17408176

    申请日：2021-08-20

    Applicant: STMicroelectronics S.r.l.

    Inventor： Giuliano Filpi ,  Antonio Montanino

    IPC: G06K19/06 ,  G06K19/077

    CPC classification number: G06K19/07722

    Abstract: An exemplary package comprises a smart card having a first side and a second side, the first side comprising a first area having reproduced thereon first readable information and a second area having reproduced thereon second readable information. The first side having a laminar member applied so as to cover the first side, the laminar member comprising a light-impermeable material and a first light-permeable portion at the first side. The first readable information is visible through the first light-permeable portion and the second readable information is covered and made invisible by the light-impermeable material. A light-permeable film material is wrapped onto the smart card having the laminar member applied thereon.

    CARD PACKAGING METHOD, CORRESPONDING PACKAGED CARD AND METHOD OF USE
    4.
    发明申请
    CARD PACKAGING METHOD, CORRESPONDING PACKAGED CARD AND METHOD OF USE 有权

    公开(公告)号：US20220067474A1

    公开(公告)日：2022-03-03

    申请号：US17408176

    申请日：2021-08-20

    Applicant: STMicroelectronics S.r.l.

    Inventor： Giuliano Filpi ,  Antonio Montanino

    IPC: G06K19/077

    Abstract: An exemplary package comprises a smart card having a first side and a second side, the first side comprising a first area having reproduced thereon first readable information and a second area having reproduced thereon second readable information. The first side having a laminar member applied so as to cover the first side, the laminar member comprising a light-impermeable material and a first light-permeable portion at the first side. The first readable information is visible through the first light-permeable portion and the second readable information is covered and made invisible by the light-impermeable material. A light-permeable film material is wrapped onto the smart card having the laminar member applied thereon.

    IC card
    5.
    发明授权
    IC card 有权
    IC卡

    公开(公告)号：US09430731B2

    公开(公告)日：2016-08-30

    申请号：US14640215

    申请日：2015-03-06

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Giuliano Filpi ,  Antonio Sismundo

    IPC: G06K19/06 ,  G06K19/077

    CPC classification number: G06K19/07739

    Abstract: An integrated circuit card includes a substrate and an integrated circuit carried by the substrate. A first sector is delimited by a first weakening line on the substrate, with the first sector being able to be separated from the substrate. A second sector is delimited by a second weakening line inside the first sector, with the second sector being able to be separated from the substrate and having the integrated circuit thereon. A disposable frame-piece is defined between the first and second weakening lines of the first and second sectors, and has a ring form. A breakage lug is arranged with respect to the disposable frame-piece to break the disposable frame-piece so that it is no longer intact, during separation of the second sector from the substrate.

    Abstract translation: 集成电路卡包括基板和由基板承载的集成电路。 第一扇区由衬底上的第一弱化线限定，第一扇区能够与衬底分离。 第二扇区由第一扇区内的第二弱化线限定，第二扇区能够与衬底分离并且在其上具有集成电路。 一次性框架件限定在第一和第二扇区的第一和第二弱化线之间，并且具有环形。 相对于一次性框架件布置破损凸耳，以在第二扇区与基板分离期间破坏一次性框架件使得其不再完整。

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