公开(公告)号：US20240272088A1

公开(公告)日：2024-08-15

申请号：US18168017

申请日：2023-02-13

Applicant: STMicroelectronics S.r.l.

Inventor： Michele Calabretta ,  Francesco Rundo ,  Salvatore Coffa ,  Marco Alfio Torrisi ,  Riccardo Emanuele Sarpietro

IPC: G01N21/95 ,  G06T7/00

CPC classification number: G01N21/9501 ,  G06T7/0004 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30148

Abstract: In an embodiment, a method includes: capturing a first image of a power module, the power module including a power electronics circuit, the power electronics circuit including power semiconductor dies; identifying positions of the power semiconductor dies in the first image with a die detection model; extracting second images of the power semiconductor dies from the first image according to the positions of the power semiconductor dies in the first image; and identifying defects of the power semiconductor dies in the second images with a defect detection model, the defect detection model being different from the die detection model.