公开(公告)号：US20030077881A1

公开(公告)日：2003-04-24

申请号：US10214998

申请日：2002-08-08

Applicant: STMicroelectronics S.r.l.

Inventor： Ilaria Gelmi ,  Simone Sassolini ,  Stefano Pozzi ,  Massimo Garavaglia

IPC: H01L021/301

CPC classification number: B81C1/0088

Abstract: A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.

Abstract translation: 用于操作集成在半导体晶片上并且要彼此切割的MEMS器件的方法包括将包括MEMS器件的半导体晶片粘合在支撑体上并插入粘结片。 该方法还可以包括将半导体晶片完全切割或切割成多个独立的MEMS器件，以及在半导体晶片的处理环境中处理在支撑体上切割和结合的MEMS器件。 还包括用于操纵MEMS器件的支持。