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1.发明申请Method for the adhesion of two elements, in particular of an integrated circuit, for example an encapsulation of a resonator, and corresponding integrated circuit 审中-公开用于两个元件，特别是集成电路的粘合的方法，例如谐振器的封装以及相应的集成电路公开(公告)号：US20040149808A1
公开(公告)日：2004-08-05
申请号：US10729827
申请日：2003-12-05
Applicant: STMicroelectronics SA
Inventor： Guillaume Bouche , Pascal Ancey , Benoit Froment
IPC: B23K031/02
CPC classification number: B81C1/00333 , H03H9/105 , H03H9/175
Abstract: A method for attaching a first element to a second element is provided. The first element has a surface portion covered with a layer of silicon, and the second element has a surface portion covered with a layer of nickel. The method includes applying pressure so that the surface portions of the first and second elements are in contact with one another. A roughness between the surface portions is less than about 1 nullm, and the first and second elements are heated within a range of about 250null C. to 400null C.
Abstract translation: 提供了将第一元件附接到第二元件的方法。 第一元件具有覆盖有硅层的表面部分，并且第二元件具有覆盖有镍层的表面部分。 该方法包括施加压力使得第一和第二元件的表面部分彼此接触。 表面部分之间的粗糙度小于约1um，第一和第二元件在约250℃至400℃的范围内被加热。
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