公开(公告)号：US20250056881A1

公开(公告)日：2025-02-13

申请号：US18927364

申请日：2024-10-25

Applicant: Samsung Display Co., Ltd.

Inventor： Se Hoon JEONG ,  Seung Wook KWON ,  Jae Sik KIM ,  Woo Yong SUNG ,  Seo Yeon LEE ,  Ung Soo LEE ,  Ja Min LEE ,  Jeong Seok LEE ,  Seung Gun CHAE ,  Seung Yeon CHAE

IPC: H01L27/12 ,  G02F1/1333 ,  G02F1/1362 ,  H01L25/16

Abstract: A display device includes a display layer comprising pixels, each of the pixels having at least one thin-film transistor, a connection line electrically connected to the at least one thin-film transistor, the connection line being exposed on a lower surface of the display layer through a first contact hole formed in the display layer, a barrier layer disposed on the lower surface of the display layer and including a second contact hole connected to the first contact hole, a lead line disposed on a lower surface of the barrier layer and electrically connected to the connection line through the second contact hole, a pad part disposed on the lower surface of the barrier layer and electrically connected to the lead line, and a lower film overlapping the lower surface of the barrier layer and the lead line.

公开(公告)号：US20220077195A1

公开(公告)日：2022-03-10

申请号：US17400792

申请日：2021-08-12

Applicant: Samsung Display Co., LTD.

Inventor： Se Hoon JEONG ,  Seung Wook KWON ,  Jae Sik KIM ,  Woo Yong SUNG ,  Seo Yeon LEE ,  Ung Soo LEE ,  Ja Min LEE ,  Jeong Seok LEE ,  Seung Gun CHAE ,  Seung Yeon CHAE

IPC: H01L27/12 ,  H01L25/16

Abstract: A display device includes a display layer comprising pixels, each of the pixels having at least one thin-film transistor, a connection line electrically connected to the at least one thin-film transistor, the connection line being exposed on a lower surface of the display layer through a first contact hole formed in the display layer, a barrier layer disposed on the lower surface of the display layer and including a second contact hole connected to the first contact hole, a lead line disposed on a lower surface of the barrier layer and electrically connected to the connection line through the second contact hole, a pad part disposed on the lower surface of the barrier layer and electrically connected to the lead line, and a lower film overlapping the lower surface of the barrier layer and the lead line.