公开(公告)号：US20220087015A1

公开(公告)日：2022-03-17

申请号：US17410436

申请日：2021-08-24

Applicant: Samsung Display Co., LTD.

Inventor： Tae Jin PARK ,  Gyung Hyun KO ,  Hee Ju MA ,  Woo Jin LEE ,  Yeon Je CHO

IPC: H05K1/02 ,  H05K3/28

Abstract: Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.