公开(公告)号：US20220279654A1

公开(公告)日：2022-09-01

申请号：US17562493

申请日：2021-12-27

Applicant: Samsung Display Co., Ltd.

Inventor： JAEJIN OH ,  Junho KWACK ,  Dongjin PARK ,  Kyung-Mok LEE ,  Dong-Youb LEE

IPC: H05K1/11 ,  H05K1/02 ,  H01L27/12 ,  G01R27/08

Abstract: An electronic apparatus includes an electronic panel including a plurality of pads, a circuit board including a plurality of leads, and a conductive adhesive member configured to electrically connect the circuit board and the electronic panel. The plurality of pads include a plurality of pixel pads, an arrangement pad, and a resistance measurement pad disposed between the arrangement pad and the pixels pads and insulated from the pixel pads. The plurality of leads include a plurality of pixel leads, an arrangement lead, and a resistance measurement lead disposed between the pixel leads and the arrangement lead and insulated from the pixel leads, The resistance measurement lead includes a plurality of resistance measurement leads disposed between the arrangement lead and the pixel leads and electrically connected with the resistance measurement pad, and a dummy lead spaced apart from the plurality of resistance measurement leads in a plan view.

公开(公告)号：US20240138065A1

公开(公告)日：2024-04-25

申请号：US18400347

申请日：2023-12-29

Applicant: Samsung Display Co., Ltd.

Inventor： JAEJIN OH ,  JUNHO KWACK ,  DONGJIN PARK ,  KYUNG-MOK LEE ,  DONG-YOUB LEE

IPC: H05K1/11 ,  G01R27/08 ,  H01L27/12 ,  H05K1/02

CPC classification number: H05K1/118 ,  G01R27/08 ,  H01L27/124 ,  H05K1/0268 ,  H05K2201/10128

Abstract: An electronic apparatus includes an electronic panel including a plurality of pads, a circuit board including a plurality of leads, and a conductive adhesive member configured to electrically connect the circuit board and the electronic panel. The plurality of pads include a plurality of pixel pads, an arrangement pad, and a resistance measurement pad disposed between the arrangement pad and the pixels pads and insulated from the pixel pads. The plurality of leads include a plurality of pixel leads, an arrangement lead, and a resistance measurement lead disposed between the pixel leads and the arrangement lead and insulated from the pixel leads. The resistance measurement lead includes a plurality of resistance measurement leads disposed between the arrangement lead and the pixel leads and electrically connected with the resistance measurement pad, and a dummy lead spaced apart from the plurality of resistance measurement leads in a plan view.