公开(公告)号：US20140360662A1

公开(公告)日：2014-12-11

申请号：US14160296

申请日：2014-04-07

Applicant: Samsung Display Co., Ltd.

Inventor： Young In LIM ,  Kyu Ho JUNG ,  Sang Hee CHOI

IPC: B32B37/00 ,  B29C65/00

CPC classification number: B32B37/003 ,  B32B37/12 ,  B32B2457/206 ,  C09J5/00

Abstract: An apparatus and system for bonding substrates are presented. The apparatus includes a base member formed of an insulating material and an electric field generation part formed of a conductive material. The electric field generation part extends into the base member. The electric field generation part includes a trunk part and a branch part. The trunk part extends in a first direction. The branch part extends from the trunk part in a direction different from the first direction. A substrate is fixed on the base member. An adhesive is applied on the substrate in a shape that matches that of the electric field generation part. An electric field is generated using the electric field generation part and the substrate is bonded to another substrate. The apparatus prevents or reduces formation of air bubbles in the adhesive. A method of manufacturing a display device is also presented.

Abstract translation: 提出了一种用于接合基板的装置和系统。 该装置包括由绝缘材料形成的基底部件和由导电材料形成的电场产生部件。 电场产生部分延伸到基底部件中。 电场产生部分包括主干部分和分支部分。 主体部分沿第一方向延伸。 分支部分从主体部分沿与第一方向不同的方向延伸。 基板固定在基体上。 将粘合剂以与电场产生部分相匹配的形状施加在基底上。 使用电场产生部产生电场，并且将基板接合到另一基板。 该装置防止或减少粘合剂中气泡的形成。 还提出了一种制造显示装置的方法。