公开(公告)号：US10812804B2

公开(公告)日：2020-10-20

申请号：US15815060

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeong-jo Park ,  Cho-rok Kwon ,  Sang-min Kim ,  Somraj Mani ,  Min-gyu Sim ,  Sung-min Chun

IPC: H04N19/159 ,  H04N19/89 ,  H04N19/61 ,  H04N19/174

Abstract: Disclosed are an image processing device and an image processing method performing a slice-based compression. The image processing method includes applying a first compression method to some slices of a first frame image including first to N-th slices (N is an integer of 2 or greater) to generate an I-slice, applying a second compression method to the other slices of the first frame image to which the first compression was not applied to generate a plurality of P-slices, and transmitting less than N packets including the generated I-slice and the generated P-slices with respect to the first frame image.