公开(公告)号：US12096178B2

公开(公告)日：2024-09-17

申请号：US17817305

申请日：2022-08-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byunggun Choi ,  Sangmin Ye ,  Sangmin Baek ,  Changi Park

IPC: H04R1/28 ,  H04R1/02

CPC classification number: H04R1/2811 ,  H04R1/025 ,  H04R1/28 ,  H04R1/2849 ,  H04R1/2857 ,  H04R1/2888 ,  H04R2499/11

Abstract: In various example embodiments, an electronic device 300 may include: a housing 310 including a first housing 311 facing a first direction, and a second housing 312 facing a second direction opposite to the first direction; a sound module 340 disposed on a surface of the first housing 311 facing the second direction and configured to generate a sound; an acoustic duct 350 formed in the first housing 311 such that the sound module 340 and an outside of the electronic device 300 communicate with each other, and configured to transmit the sound generated by the sound module 340 to the outside of the electronic device 300; and a resonance structure 360 formed in the first housing 311 to communicate with the acoustic duct 350 to tune a resonance characteristic according to a shape of the acoustic duct 350.

公开(公告)号：US12212905B2

公开(公告)日：2025-01-28

申请号：US17982054

申请日：2022-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changi Park ,  Jeho Chung

IPC: H04R25/00 ,  H04R1/02 ,  H04R9/02

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board, a speaker unit including a speaker housing and a diaphragm, and a support member including a first portion surrounding a portion of the speaker unit and spaced apart from a surface of the speaker unit by a predetermined gap and a second portion extending from the first portion to cover a surface of a portion of the first printed circuit board. A first space located on one side of the diaphragm is formed in the speaker housing, and a second space in fluid communication with the first space is formed between the first portion and the surface of the speaker unit. The second portion and the first printed circuit board form at least a portion of a substantially sealed third space in fluid communication with the second space.

公开(公告)号：US11799253B2

公开(公告)日：2023-10-24

申请号：US17293766

申请日：2019-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonwook Lee ,  Bangmin Kim ,  Sanghyuk Park ,  Changi Park ,  Junho Son ,  Dongju Yeon ,  Jonghee Ham

IPC: H01R13/62 ,  H01R27/02 ,  H02J7/00 ,  G06F3/16 ,  H01R24/64

CPC classification number: H01R27/02 ,  G06F3/162 ,  H01R24/64 ,  H02J7/00034

Abstract: An electronic apparatus according to various embodiments comprises: a receptacle including a plurality of GND pins, a first CC pin, and a second CC pin and to which a first USB-type plug is insertable; and at least one processor, wherein the at least one processor is configured to: determine whether an external apparatus is connected and the external apparatus supports high-speed charging, by using at least one of the first CC pin and the second CC pin; determine whether the external apparatus supports an audio signal output, by using at least one of the plurality of GND pins, when the external apparatus is determined to support the high-speed charging; and transmit and receive at least one of data or electricity to and from the external apparatus, on the basis of whether the external apparatus supports the high-speed charging and the audio signal output. In addition, other embodiments are possible.