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公开(公告)号:US20250120015A1
公开(公告)日:2025-04-10
申请号:US18974667
申请日:2024-12-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihoon KANG , Jongmin KIM , Chungil CHOI
Abstract: An electronic device includes a first housing having a first through-hole, of which a first opening and a second opening are communicated with each other, and a second housing connected to the first housing to be rotatable. A flexible printed circuit board (FPCB) extends from the first housing to the second housing via the first through-hole. The FPCB includes a plurality of layers, a first sealing member disposed in the first through-hole and surrounding the FPCB, and a lamination part toward the first sealing member. A portion of a first layer and/or a second layer corresponding to the second lamination part includes at least one first valley extending from a surface that faces an adjacent layer in a lengthwise direction of the FPCB. The lamination part includes a first adhesive layer interposed between the first layer and the second layer and filling the at least one first valley.
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公开(公告)号:US20230043759A1
公开(公告)日:2023-02-09
申请号:US17879280
申请日:2022-08-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihoon KANG , Jongmin KANG , Chungil CHOI
Abstract: An electronic device includes a first housing having a first through-hole, of which a first opening and a second opening are communicated with each other, and a second housing connected to the first housing to be rotatable. A flexible printed circuit board (FPCB) extends from the first housing to the second housing via the first through-hole. The FPCB includes a plurality of layers, a first sealing member disposed in the first through-hole and surrounding the FPCB, and a lamination part toward the first sealing member. A portion of a first layer and/or a second layer corresponding to the second lamination part includes at least one first valley extending from a surface that faces an adjacent layer in a lengthwise direction of the FPCB. The lamination part includes a first adhesive layer interposed between the first layer and the second layer and filling the at least one first valley.
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公开(公告)号:US20200383215A1
公开(公告)日:2020-12-03
申请号:US16865634
申请日:2020-05-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jongyoon KIM , Jungjin KIM , Chungkeun YOO , Seunghyun HWANG , Jungwon PARK , Chungil CHOI , Daehyeong PARK , Minwoo YOO
Abstract: Disclosed is an electronic device including a first housing, a second housing, a display disposed on the first housing and the second housing, at least one hinge structure that connects the first housing and the second housing, a hinge housing that surrounds at least part of the at least one hinge structure, and at least one foreign matter collection member that is disposed on one side of the at least one hinge structure and that collects foreign matter introduced into the electronic device.
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公开(公告)号:US20220369476A1
公开(公告)日:2022-11-17
申请号:US17873796
申请日:2022-07-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jongyoon KIM , Jungjin KIM , Chungkeun YOO , Seunghyun HWANG , Jungwon PARK , Chungil CHOI , Daehyeong PARK , Minwoo YOO
Abstract: Disclosed is an electronic device including a first housing, a second housing, a display disposed on the first housing and the second housing, a first hinge plate coupled to the first housing, a second hinge plate coupled to the second housing, and at least one hinge structure coupled to the first hinge plate and the second hinge plate, wherein the at least one hinge structure comprises a center bracket, a first hinge bracket coupled to the center bracket and configured to rotate in a first direction, a second hinge bracket connected to the center bracket and configured to rotate in a second direction, and at least one hole formed in the center bracket.
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